Desfran concluded its debut at the Hong Kong FinTech Week on 6 November, following a successful five-day run virtually. Amid the challenges presented by the pandemic, this year’s exhibition provided an imperative opportunity for domestic and international banking, finance and technology industries to source and reconnect through online meetings. Attended by key stakeholders from different realms, topics that are widely discussed during keynote events and webinars include neobanks, artificial intelligence (AI), and big data
The trade show provided Desfran with the opportunity to experience an exciting new digital dimension, and to catch a glimpse of futuristic technologies which can benefit financial institutions and businesses.
Daniel Teo, Chief Business Development Officer of Desfran, overseeing Hong Kong operations said: “We have been working with our clients and partners in Hong Kong for over two years, and this is our first foray as an exhibitor in Hong Kong FinTech Week in bid to keep abreast to current times and forge new partnerships as well as strengthen existing business relationships”.